ISMI Manufacturing Week
“Environmental Characterization”
Tuesday, November 2
8AM-5PM
Instructor: Mike Sherer, P.E.
It is essential that a wafer fab develop a process exhaust management strategy to determine when point-of-use (POU) abatement devices are needed and what the best technology should be used. The development of a fab process exhaust management strategy will be discussed in detail. Information will be provided on the POU abatement device technologies, operations and issues. Process emissions and POU abatement device destruction and removal efficiency testing methodologies (2009 ISMI Guideline and EPA POU Abatement Device Testing Protocol) will be presented. Testing lessons learned will be provided. The most current proposed or final EPA GHG Reporting Rule will be reviewed and possible compliance strategies shared/discussed with the audience.
About the Instructor
Mike Sherer, P.E. is the Principal of Sherer Consulting Services, Inc. Mike has 29 years of experience in environmental projects, specializing in air. He has worked in the semiconductor industry for 18 years and has reviewed exhaust management, point-of-use abatement and centralized air abatement equipment in over 80 fabs worldwide. Mike has published a book titled, “Semiconductor Industry: Wafer Fab Exhaust Management.”
Who Should Attend
ESH Compliance Professionals, Facilities Engineers and Managers responsible for exhaust management in fabs, or for monitoring, collecting, analyzing, and reporting emissions to comply with environmental and safety regulatory requirements.
How To Register
You must register to attend this short course. ISMI members may register at no charge; $300 for all others.
